Receiving the semiconductor packaging service from OSAT* companies is not an easy
process especially when the product is under development level, or the expected volume for mass production is not sufficient.
For customers who need to develop futuristic package product but cannot access to
OSAT service, LIPAC is willing to have the partnership and deliver the satisfiable
packaging service to the customer.
Upon a customer's request on exact specification and components for the package,
LIPAC delivers full-service on package design, packaging (molding / bumping) and final
test with highest quality and minimal delivery time.
Die information, package outline dimension, netlist and design rule should be given to LIPAC.
LIPAC provides electrical and optical design service of the package. Wafer map and photo-mask design is also provided.
O-SiP fabrication based on FOWLP (Fan Out Wafer Level Package) is provided, including wafer-level molding and bumping process.
Visual inspection and O/S (Open/Short) test service can be provided. Also, the electrical and optical function testing can be provided under request.
Minimal Delivery Time
LIPAC's fabrication site is located at Ochang Scientific Industrial Complex in Chungcheongbuk-do, Republic of Korea, where IT convergence industry is vitalized at.
Address : Smart IT Kwan, Clean-room, 76, Yeongudanji-ro, Ochang-eup, Cheongwon-gu, Cheongju-si, Chungcheongbuk-do, Republic of Korea, 28116
For more detailed information, please contact to info@LIPAC.co.kr